|
Nau'in Substrate. |
Hanyoyin tattarawa |
Sunayen fakitin |
|
Babu wani abu da ake buƙata |
Fan-Out
|
|
|
WLCSP
|
||
|
Ƙwayoyin halitta |
Waya-bond
|
BGA, LGA 4909101} )
|
|
Juya Chip
|
BGA （ FC BGA, FO akan Substrate, 2.5D, 3D {420910} {490910} 08014} 3136558} CSP
|
|
|
Tushen firam ɗin jagora |
Waya-bond
|
QFN/QFP, SOIC, TSOP, LCC, DIP
|
|
Juya Chip
|
FC QFN
|
|
|
Substrate yumbura |
Waya-bond
|
Hi Rel
|
|
Juya Chip
|
HTCC, LTCC
|
Idan kuna son ƙarin koyo ko ƙarin bayani game da abubuwan da ake so, kawai danna " {414080} {419080CT4909101} " maballin a saman, tallace-tallacenmu zai ba ku ƙarin bayani yayin da kuke karɓar oda.
